IEEE/ACM International Symposium on Quality of Service
10–12 June 2022 // Virtual Conference

Committee

General Chairs

Olav Lysne, Simula Metropolitan Center for Digital Engineering (SimulaMet), Norway

Frank Eliassen, University of Oslo, Norway

Program Chairs

Yan Zhang, University of Oslo, Norway

Ahmed Elmokashfi, Simula Metropolitan Center for Digital Engineering (SimulaMet), Norway

Yong Cui, Tsinghua University, China

Finance Chair

Foivos Ioannis Michelinakis, Simula Metropolitan Center for Digital Engineering (SimulaMet), Norway

Min Zhang, University of Oslo, Norway

Publication Chair

Kun Wang, UCLA, U.S.A.

Gerhard Hancke, City University of Hong Kong, China

Web Chair

Thomas Dreibholz, Simula Metropolitan Center for Digital Engineering (SimulaMet), Norway

Publicity Chair

Cristina Alcaraz, University of Málaga, Spain

Celimuge Wu, The University of Electro-Communications, Japan

Jiao Zhang, Beijing University of Post and Telecommunications, China

Yueyue Dai, Nanyang Technological University, Singapore

Program Committee

Azza Ahmed, Simula Metropolitan Centre for Digital Engineering

Robert Birke, ABB Corporate Research

Torsten Braun, University of Bern

Jun Cai, Concordia University

Eduardo Cerqueira, Federal University of Para & UCLA

Yang Chen, Fudan University, China

Octav Chipara, University of Iowa

Nakjung Choi, Nokia

Domenico Ciuonzo, University of Naples Federico II

Noel Crespi, Institut Mines-Télécom, Télécom SudParis

Haipeng Dai, Nanjing University

Luca Davoli, University of Parma

Fang Dong, Southeast University

Yingfei Dong, University of Hawaii, USA

Thomas Dreibholz, Simula Metropolitan Centre for Digital Engineering

Song Fang, University of Oklahoma

Serge Fdida, Sorbonne University

Mah-Rukh Fida, Simula Metropolitan Centre for Digital Engineering

Valerio Frascolla, Intel Deutschland GmbH

Luoyi Fu, Shanghai Jiao Tong University

Yaru Fu, Hong Kong Metropolitan University

Marisol García-Valls, Universitat Politecnica de Valencia

Yacine Ghamri-Doudane, University of la Rochelle

Xiaowen Gong, Auburn University

Carsten Griwodz, Universitetet i Oslo

Zhangyu Guan, University at Buffalo, USA

Deke Guo, National University of Defense Technology

Yingya Guo, Fuzhou University

Go Hasegawa, Tohoku University

Michiaki Hayashi, KDDI Corporation

Yuan He, Tsinghua University

Pan Hui, Hong Kong University of Science and Technology

Lei Jiao, University of Oregon

Mingyue Ji, University of Utah, USA

Gunnar Karlsson, KTH Royal Institute of Technology

JongWon Kim, GIST (Gwangju Institute of Science & Technology)

Taekyoung Kwon, Seoul National University

Baochun Li, University of Toronto

Ruidong Li, Kanazawa University

Tao Li, Indiana University-Purdue University Indianapolis, USA

Fangming Liu, Huazhong University of Science and Technology

Lu Liu, University of Leicester

Min Liu, Institute of Computing Technology, Chinese Academy of Sciences

Wai-Xi Liu, Guangzhou University

Zhi Liu, The University of Electro-Communications, Japan

Ioana Livadariu, Simula Research Laboratory

Zhetao Li, Xiangtan University

Changqing Luo, Virginia Commonwealth University

Xiapu Luo, The Hong Kong Polytechnic University

Rongxing Lu, University of New Brunswick

Yunlong Lu, Beijing University of Posts and Telecommunications

Feng Lyu, Central South University

Pietro Manzoni, Universitat Politècnica de València, Spain

Giuseppe Di Modica, University of Bologna

Di Niu, University of Alberta, Canada

Yasuo Okabe, Kyoto University

Sangheon Pack, Korea University

Miao Pan, University of Houston, USA

Dan Pei, Tsinghua University, China

Kandaraj Piamrat, LS2N / University of Nantes

Kaliappa Ravindran, City University of New York

Danda Rawat, Howard University

Ju Ren, Tsinghua University

Francesco Restuccia, Northeastern University

Abusayeed Saifullah, Iowa State University

Meng Shen, Beijing Institute of Technology, China

Hiroshi Shigeno, Keio University

Hideyuki Shimonishi, NEC

Biplab Sikdar, National University of Singapore

Simone Silvestri, University of Kentucky

Houbing Song, Embry-Riddle Aeronautical University, USA

Wen Sun, Northwestern Polytechnical University

Junji Takemasa, Osaka University

Haisheng Tan, University of Science and Technology of China

Ye Tian, Beijing University of Posts and Telecommunications

Eirini Eleni Tsiropoulou, University of New Mexico

Keisuke Uehara, KEIO University

Bo Wang, Tsinghua University, China

Dan Wang, The Hong Kong Polytechnic University

Haiyang Wang, University of Minnesota at Duluth, USA

Yi Wang, Southern University of Science and Technology

Zhibo Wang, Zhejiang University

Kohei Watabe, Nagaoka University of Technology

Michael Welzl, University of Oslo

Tilman Wolf, University of Massachusetts Amherst

Celimuge Wu, The University of Electro-Communications

Chuan Wu, The University of Hong Kong

Fan Wu, Shanghai Jiao Tong University, China

Kui Wu, University of Victoria

Weiwei Wu, Southeast University

Yuan Wu, University of Macau

Chaocan Xiang, Chongqing University

Fu Xiao, Nanjing University of Posts and Telecommunications

Liang Xiao, Xiamen University

Yang Xiao, The University of Alabama

Chenren Xu, Peking University

Yang Xu, Fudan University

Yuedong Xu, Fudan University

Jie Yang, Florida State University, USA

Panlong Yang, University of Science and Technology of China

Yating Yang, Beijing Institute of Technology, China

Fan Ye, Stony Brook University, USA

Feng Ye, University of Dayton

Shui Yu, University of Technology Sydney, Australia

Huacheng Zeng, Michigan State University, USA

Beichuan Zhang, University of Arizona

Chaokun Zhang, Tianjin University

Jiao Zhang, Beijing University of Post and Telecommunications, China

Lei Zhang, Tsinghua University, China

Liang Zhang, Huawei Corporation

Shenglin Zhang, Nankai University

Xinggong Zhang, Peking University, China

Yuchao Zhang, Beijing University of Posts and Telecommunications, China

Zhi-Li Zhang, University of Minnesota

Baokang Zhao, National University of Defense Technology

Yi Zhao, Tsinghua University

Kai Zheng, Huawei Technologies

Xiaolong Zheng, Beijing University of Posts and Telecommunications

Liehuang Zhu, Beijing Institute of Technology

Yifei Zhu, Shanghai Jiao Tong University